EMPC 2017 European Microelectronics and Packaging Conference & Exhibition

September 10, 2017 – September 13, 2017 all-day


The International Microelectronics and Packaging Society (IMAPS) is a worldwide organization, which leads communication, education and interaction at all levels in the field. IMAPS is dedicated to the growth of the community focused on developments of microelectronics and packaging technologies of the present and future, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management, Modeling/Design/Simulation, Reliability.

For the first time the conference is organized in eastern part of Europe. This gives an extra opportunity to bring together the entire microelectronics supply chain, technical and marketing professionals from all parts of Europe. The variety of sessions offers the possibility to enhance professional development, technical knowledge/skills and career progression. Furthermore, the industrial exhibition will highlight the latest products and service applications of value to the electronics community.

The conference is an important platform for dialogue between industry and academia. At EMPC 2017, we will provide you with an excellent technical programme of most recent research and development results worldwide.

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