By Bart Vandevelde
In particular for testing of the board level interconnect reliability of components, bending cycling can be an interesting alternative for regular thermal cycling. The main gain lies in the testing time. The four point bending stresses the interconnections in a similar way as in thermal cycling, but as the test can be performed at constant temperature, the cycle rate can be easily increased without the issue of heating and cooling the total thermal mass.
In this webinar, we will explain the concept for four-point bending cycling of soldered components and how it can be related to thermal cycling. Also test results for CSP and QFN components will be shown, which proofs the usefulness of this alternative testing approach.